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MAX15024/MAX15025
Single/Dual, 16ns, High Sink/Source
Current Gate Drivers
ABSOLUTE MAXIMUM RATINGS
V CC to GND ............................................................-0.3V to +30V
REG to GND ..............-0.3V to the lower of +22V or (V CC + 0.3V)
DRV to PGND .........................................................-0.3V to +22V
IN_ ..........................................................................-0.3V to +22V
FB/SET to GND.........................................................-0.3V to +6V
P_OUT to DRV ........................................................-22V to +0.3V
N_OUT to PGND.....................................................-0.3V to +22V
OUT1, OUT2 to PGND ..............................-0.3V to (V DRV + 0.3V)
PGND to GND .......................................................-0.3V to +0.3V
P_OUT, N_OUT Continuous Source/Sink Current* .......... 200mA
Continuous Power Dissipation (T A = +70°C)
10-Pin TDFN, Single-Layer Board
(derate 18.5mW/°C above +70°C) ...........................1481.5mW
10-Pin TDFN, Multilayer Board
(derate 24.4mW/°C above +70°C) ...........................1951.2mW
Operating Temperature Range .........................-40°C to +125°C
Junction Temperature ......................................................+150°C
Storage Temperature Range .............................-65°C to +150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
OUT1, OUT2 Continuous Source/Sink Current*................200mA
*Continuous output current is limited by the power dissipation of the package.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
10 TDFN
Junction-to-Ambient Thermal Resistance ( θ JA )...............41°C/W
Junction-to-Case Thermal Resistance ( θ JC )......................9°C/W
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer
board. For detailed information on package thermal considerations, refer to http://www.maxim-ic.com/thermal-tutorial .
MAX15024 ELECTRICAL CHARACTERISTICS
(V CC = V DRV = V REG = 10V, FB/SET = GND, T A = T J = -40°C to +125°C, unless otherwise noted. Typical values are at T A = T J =
+ 25°C). (Note 2)
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
SYSTEM SPECIFICATIONS
V CC powered only, V REG =
MAX15024B
6.5
28.0
V DRV decoupled with
Input Voltage Range
V CC
minimum 1μF to GND
MAX15024A
4.5
28.0
V
V CC = V REG = V DRV (MAX15024B)
V CC = V REG = V DRV (MAX15024A)
6.5
4.5
18.0
18.0
V DRV Turn-On Voltage
Quiescent Supply Current
Quiescent Supply Current
Under UVLO Condition
Switching Supply Current
V DRV _ ON
V CC = V REG = 10V, IN+ = V CC , IN- = GND
IN_ = V CC or GND
IN_ = V CC or GND
Switching at 250kHz, C L = 0F
1.7
700
250
1.5
2.3
1350
3.0
V
μA
μA
mA
V CC Undervoltage Lockout
UVLO_ V CC
V CC rising
3.0
3.4
3.8
V
V CC Undervoltage-Lockout
Hysteresis
300
mV
V CC Undervoltage Lockout to
Output Delay
V CC rising
V CC falling
100
2
μs
REG REGULATOR (V CC = 12V, REG = V DRV , C L = 1μF, FB/SET = GND)
Output Voltage
Dropout Voltage
V REG
V R _ DO
12V < V CC < 28V, 0 < I LOAD < 10mA
V CC = 6.5V, I LOAD = 100mA
V CC = 4.5V, I LOAD = 50mA
9
10
0.4
0.2
11
0.9
0.5
V
V
2
Load Regulation
Line Regulation
V CC = 12V, I LOAD = 0 to 100mA
12V < V CC < 28V
1
10
%
mV
Maxim Integrated
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